By John H. Lupinski and Robert S. Moore (Eds.)
content material: Polymeric fabrics for electronics packaging and interconnection : an summary / John H. Lupinski and Robert S. Moore --
remedy reviews of PMDA-ODA- and BTDA-ODA-based polyimides by way of fluorescence spectroscopy / Eric D. Wachsman, Peter S. Martin, and Curtis W. Frank --
Dynamic Fourier transform-IR research of healing reactions and kinetics of polyimides / Randy W. Snyder and Paul C. Painter --
Polyimide hydrolysis : dimension via Fourier transform-IR spectroscopy / Coralie A. Pryde --
Dielectric characterization of water in polyimide and poly(amide-imide) skinny movies / Allyson J. Beuhler, Neal R. Nowicki, and Joanne M. Gaudette --
Calculated final-state results of the PMDA-ODA polyimide X-ray photoemission spectrum / A.R. Rossi and B.D. Silverman --
impact of diamic acid ingredients on dielectric constants of polyimides / Diane M. Stoakley and Anne okay. St. Clair --
natural dielectric fabrics with lowered moisture absorption and greater electric homes / D.L. Goff, E.L. Yuan, H. lengthy, and Herbert J. Neuhaus --
Synthesis and characterization of the t-butyl ester of the oxydianiline-pyromellitic dianhydride polyamic acid / F.M. Houlihan, B.J. Bachman, C.W. Wilkins, Jr., and Coralie A. Pryde --
Curing of binary combos of polyimides / C. Feger --
Polyimides for dielectric layers / L.M. Baker, P.J. Brown, and J.L. Markham --
Siloxane polyimides for interlayer dielectric purposes / P.P. Policastro, John H. Lupinski, and P.K. Hernandez --
Electrophoretic deposition of polyimides : electrocoating at the cathode / Stephen L. Buchwalter --
sped up trying out of polyimide coatings for neural prostheses / J. McHardy, D.I. Basiulis, G. Angsten, L.R. Higley, and R.N. Leyden --
Conduction transients in polyimides / Herbert J. Neuhaus and Stephen D. Senturia --
Polymer insulating layers for multilayer hybrid circuits / L.M. Baker, J.L. Markham, and R.D. Small --
Fabrication and homes of thermoset motion pictures derived from bis-benzocyclobutene for multilayer functions / S.F. Hahn, P.H. Townsend, D.C. Burdeaux, and J.A. Gilpin --
Synthesis of poly(arylene ether phenylquinoxaline) / James L. Hedrick and Jeff W. Labadie --
High-performance silicone gel as integrated-circuit-device chip security : medication research and electric reliability / C.P. Wong --
Silicone gels for semiconductor purposes : chemistry and houses / Gust J. Kookootsedes --
merits of silicone gel for packaging of units with very huge scale integration (VLSI) / Kanji Otsuka, Hisashi Ishida, Yasuyuki Utsumi, Takashi Miwa, and Yuji Shirai --
Modeling of triple-track and comb-pattern leakage present measurements / Philip R. Troyk, David Conroy, and James E. Anderson --
Silicone gels and coatings for integrated-circuit packaging / Justin C. Bolger --
Ultraviolet-curable silicones for integrated-circuit safety / Michael A. Lutz and Kristen A. Scheibert --
Moisture delivery phenomena in epoxies for microelectronics functions / D.J. Belton, E.A. Sullivan, and M.J. Molter --
Heterogeneous conduction procedures in integrated-circuit encapsulation / D.A. Hoffmann, James E. Anderson, L.J. Bousse, and Curtis W. Frank --
Novel coatings that keep low surface-water concentrations / James E. Anderson, V. Markovac, I. Kim, and Philip R. Troyk --
Thermal tension in epoxy molding compounds and packaged units / W.F. van den Bogert, M.J. Molter, S.A. Gee, D.J. Belton, and V.R. Akylas --
Characterization of stresses in polymer movies for microelectronics purposes / Rolf W. Biernath and David S. Soane --
tension components in molding compounds / A.A. Gallo --
New move molding compounds / E.W. Walles, John H. Lupinski, S. Bandes, and M. Rosenfield --
Chemistry of solid brominated epoxies / C.S. Wang, D.B. Fritz, and A. Mendoza --
functionality of solid brominated epoxies in encapsulants for microelectronic units / D.B. Fritz and C.S. Wang --
New polymeric fabrics for electronics packaging / H. Hacker, K.-R. Hauschildt, J. Huber, H. Laupenmühlen, and D. Wilhelm --
Degradation of brominated epoxy resin and results on integrated-circuit-device wirebonds / M. Nakao, T. Nishioka, M. Shimizu, H. Tabata, and okay. Ito --
Enhancement of gold-aluminum wirebond reliability in plastic encapsulated very huge scale integration (VLSI) units via C-Br bond stabilization / Muhib M. Khan, Homi Fatemi, Jeremias Romero, and Eugene Delenia --
Ordered polymers for interconnection substrates / Richard Lusignea, Joseph Piche, and Richard Mathisen --
three-d circuit interconnections with thermoplastic functionality polymers / David C. Frisch and John F. Rowe --
importance of advancements in new substrate fabrics / Edward Donnelly.
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Extra resources for Polymeric Materials for Electronics Packaging and Interconnection
S i m i l a r l y , D i c k i n s o n and Sung (A) o b s e r v e d f l u o r e s c e n c e from t h e p o l y a m i c a c i d p r e c u r s o r o f 6FDA-NDA b u t d i d n o t o b s e r v e any f l u o r e s c e n c e from t h e p o l y i m i d e . However, D i c k i n s o n and Sung r e p o r t a decrease i n emission i n t e n s i t y f o r i l l u m i n a t i o n a t the absorption maximum, where we have f o u n d t h e f l u o r e s c e n t r e s p o n s e t o be a t a minimum, i n d i c a t i n g t h a t t h e y may n o t have i n v e s t i g a t e d e x c i t a t i o n a t t h e r e d edge o f t h e a b s o r p t i o n spectrum.
U n f o r t u n a t e l y , t h e PI-2555 was m i s i d e n t i f i e d i n t h a t paper as PMDA-ODA, whereas we have r e c e n t l y l e a r n e d t h a t i t i s a BTDA-ODA/MPD t y p e p o l y i m i d e and t h a t PI-2545 i s i n f a c t b a s e d on t h e PMDA-ODA s t r u c t u r e Q ) . These s t r u c t u r e s as w e l l as t h o s e o f t h e o t h e r p o l y i m i d e s i n v e s t i g a t e d a r e shown i n F i g u r e 1. T h i s d i f f e r e n c e i n t h e c h e m i c a l s t r u c t u r e o f t h e d i a n h y d r i d e fragment has m i n i m a l impact on t h e c o n c l u s i o n s drawn i n t h a t i n v e s t i g a t i o n , as w i l l become apparent i n t h e p r e s e n t paper.
This fluorescence arises as a result of excitation in either of two spectral bands. Emission from a single chromophore is observed and the two excitation bands are described in terms of both an intra- and an intermolecular charge transfer complex (CTC). The intra-CTC i s ascribed to rotation around the imide nitrogen-phenyl bond. The inter-CTC arises as a result of the increase in aggregation associated with a more ordered phase. The emission intensity from excitation of the inter-CTC band increases linearly with reciprocal intermolecuar spacing.