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By Ricky Lee S.W.

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Thermal cycling test samples with either DAI or CCB interconnections were fabricated on a silicon wafer by creating a solderable UBM pattern. Such samples work perfectly well in simulating actual power devices, since the samples are not powered up. Dimpled copper sheets measuring 8 £ 10 mm with 2 £ 3 dimple-arrays were used to connect to the conductive traces forming the DAI structure. The joints formed were roughly 1 mm in diameter. CCB joints were created by using plain copper sheets, with the solder balls forming contacts defined by a solder mask.

2, pp. 33-6. , Takahashi, K. and Iwase, N. (1997), “Thermal fatigue life prediction of solder joints using stress analysis”, Proceedings of the 1st IEEE IEMT/IMC Symposium, Sonic City, Omiya, Japan, pp. 204-8. [ 39 ] Guo-Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata and John G. Bai Strategies for improving the reliability of solder joints on power semiconductor devices Soldering & Surface Mount Technology 16/2 [2004] 27–40 We are grateful to Dan Huff for the extensive technical assistance he provided to the research effort.

And Satoh, R. 5Ag solder in microbonding”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, pp. 736-42. S. W. (1995), “Linear finite stress simulation of solder joints on 225 I/O plastic BGA packages under thermal cycling”, Proceedings of the 45th IEEE Electronic Components Technology Conference, Las Vegas, NV, pp. 930-6. Z. (1998), “Thermal fatigue analysis of a CBGA package with lead-free solder fillets”, Proceedings of the 6th Inter Society Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, (ITHERM’98), Seattle, WA, pp.

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